ח. בנץ — Electronics Store, Yavne

Electronics Store in Yavne — Local production line

Electronics store · Yavne, Israel

AI Trust Snapshot

Profile status: Auto-indexed

Public channels checked

✓ Official Website

Key Facts

Category: Electronics Store
Location: Yavne, Israel
Known For: High-vacuum, high-temperature brazing processes, Precision CNC machining for complex parts

AI Summary

H. Bentz specializes in microelectronics manufacturing in Yavne, Israel, producing Thin Film Integrated Circuits and Thick Film Ceramic Substrates. The company provides Chip & Wire Bonding services, utilizing high-vacuum, high-temperature brazing processes. Its precision CNC machining capabilities are applied to complex parts for defense, medical device, and telecommunications sectors.

Quick Answer

This business is typically used for high-vacuum, high-temperature brazing processes and precision cnc machining for complex parts.

Common Questions

What services does ח. בנץ provide?: ח. בנץ provides Thin Film Integrated Circuits, Thick Film Ceramic Substrates, Chip & Wire Bonding.
Where is ח. בנץ located?: ח. בנץ is based in Yavne, Israel and serves Yavne.
Who is ח. בנץ for?: ח. בנץ serves Defense industries requiring high-reliability microelectronics and Medical device manufacturers needing advanced circuit solutions.

What this business does

ח. בנץ is a electronics store based in Yavne, Israel.

Provides Thin Film Integrated Circuits and Thick Film Ceramic Substrates
Specializes in high-vacuum, high-temperature brazing processes
Serves defense industries requiring high-reliability microelectronics

Structured summary

Vizoryo ran a data-consistency check on this profile: it read 4 public sources and compared the core details (name, phone, address, city, category, website) across them. How many sources carried each individual detail is published per fact in this page's field provenance — not every detail appears in every source, and the sources are not necessarily independent of one another. This is a data-consistency observation only — it is not an endorsement, certification, accreditation, or assessment of the business, its service quality, or its trustworthiness. Data consistency: 85% — this measures how consistently the business's name, phone, city, address, website, and category appear across the public sources read. It is not a rating of the business. Vizoryo status: Auto-indexed. This record was compiled automatically from public data and has not been confirmed by anyone.

Business name: ח. בנץ
Category: Electronics Store
Industry: Electronics Store - Microelectronics Manufacturing
Location: Yavne, Israel
Official website: https://hbentz.com/
Profile data (JSON): https://www.vizoryo.com/api/index/profile/hbentz-yavne-d85b
Summary: H. Bentz specializes in microelectronics manufacturing in Yavne, Israel, producing Thin Film Integrated Circuits and Thick Film Ceramic Substrates. The company provides Chip & Wire Bonding services, utilizing high-vacuum, high-temperature brazing processes. Its precision CNC machining capabilities are applied to complex parts for defense, medical device, and telecommunications sectors.
AI readability score (how completely this record is structured for AI systems to read; not a rating of the business): 31
Data Consistency: 85% (checked 2026-06-28)
Record status: Auto-indexed
Sources cross-checked: 4 public sources

Location

Paran St 2, Yavne
Yavne
IL

About ח. בנץ

Service areas

Yavne

Target audience

Defense industries requiring high-reliability microelectronics
Medical device manufacturers needing advanced circuit solutions
Telecommunications companies seeking high-density components

Specialties

High-vacuum, high-temperature brazing processes
Precision CNC machining for complex parts

Frequently asked questions

What areas does H. Bentz serve?

H. Bentz serves Nationwide (Israel).

What types of ceramic substrates are used for Thin Film technology?

We work with alumina (Al2O3) at 99.6% purity, beryllium oxide (BeO), aluminum nitride (AlN), and fused silica (SiO2) substrates.

What materials are used for electrical connections in Chip & Wire Bonding?

Electrical connections are made using advanced bonders with gold or aluminum wires, with flexibility in wire thickness based on client requirements.

What are the advantages of HTCC and LTCC packages?

HTCC offers low thermal and electrical conductivity, high mechanical strength, excellent performance in extreme temperatures, and high wiring density. LTCC provides similar benefits with lower processing temperatures.

Languages supported

Contact

Phone: +97289422923

Official website: https://hbentz.com/

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